![[0304-0] Gạch thẻ VN 75x300mm họa tiết bóng xám mã 0304-0 - Daisan Mart](http://daisanmart.vn/cdn/shop/files/daisan-depot-default-0304-0-g-ch-th-vn-75x300mm-h-a-ti-t-bong-xam-ma-0304-0-29507020619949.jpg?v=1769829451&width=1280)
◆ Features: This product is a one-component, white paste silicone compound. Solvent-free, acid and alkali-free, anti-aging, anti-corrosion, anti-radiation and good weather resistance, can be used at -60 ~ 260℃. The product has good electrical insulation performance, moisture-proof and shock-proof, good heat dissipation and high bonding performance, can fully meet the bonding requirements of electronic components.
■Application：
Thermally conductive silica gel can be widely coated in various electronic products, electrical appliances, heating elements (power tubes, thyristors, electric heating piles, etc.) and heat dissipation devices (radiators, heat strips, covers, etc.) between the contact surface and the heat transfer material. Suitable for microwave communications, microwave transmission equipment, microwave dedicated power supplies, voltage regulating power supplies and other microwave devices, surface coating or integrated coating. These silicone materials have excellent thermal conductivity when used for heat generation of electronic components. Such as: transistors, CPU assemblies, thermistors, temperature sensors, automotive electronic components, automotive refrigerators, power modules, printers, etc.
Thermally conductive silica gel can be widely coated in various electronic products, electrical appliances, heating elements (power tubes, thyristors, electric heating piles, etc.) and heat dissipation devices (radiators, heat strips, covers, etc.) between the contact surface and the heat transfer material. Suitable for microwave communications, microwave transmission equipment, microwave dedicated power supplies, voltage regulating power supplies and other microwave devices, surface coating or integrated coating. These silicone materials have excellent thermal conductivity when used for heat generation of electronic components. Such as: transistors, CPU assemblies, thermistors, temperature sensors, automotive electronic components, automotive refrigerators, power modules, printers, etc.
